Heat dissipator cover
Model: YK580
Applications
Description
The YK580 heat sink is a precision-stretched and shaped heat dissipation component made of high thermal conductivity metal substrate. It integrates multiple sets of mounting holes, a shaped heat dissipation chamber, and a buckle fixing structure, providing efficient heat dissipation. The product is compatible with shaped PCB component layouts and can be securely installed through soldering or buckling. It can quickly reduce the operating temperature of core components while isolating electromagnetic interference between circuits. It meets environmental and electronic industry standards and is widely used in component heat dissipation and electromagnetic protection in industrial control equipment, communication motherboards, automotive electronics, consumer electronics, and other scenarios.
Features
- High thermal conductivity metal substrate, combining excellent thermal conductivity and structural strength, corrosion resistance, and resistance to deformation
- The integrated design of irregular shapes perfectly meets the heat dissipation needs of non-standard and irregularly arranged components, while achieving electromagnetic shielding for the corresponding circuit areas
- Precision stretch one-piece molding process, no splicing welds, high structural stability, good consistency in dimensions for mass production
- The unique heat dissipation cavity structure significantly increases the contact area with components, achieving high fit and significantly improving heat dissipation efficiency
- Multiple installation holes + dual-fastening design with clips, ensuring stable installation, compatible with SMT soldering / clip assembly
Specifications
Whitepapers
Features
- High thermal conductivity metal substrate, combining excellent thermal conductivity and structural strength, corrosion resistance, and resistance to deformation
- The integrated design of irregular shapes perfectly meets the heat dissipation needs of non-standard and irregularly arranged components, while achieving electromagnetic shielding for the corresponding circuit areas
- Precision stretch one-piece molding process, no splicing welds, high structural stability, good consistency in dimensions for mass production
- The unique heat dissipation cavity structure significantly increases the contact area with components, achieving high fit and significantly improving heat dissipation efficiency
- Multiple installation holes + dual-fastening design with clips, ensuring stable installation, compatible with SMT soldering / clip assembly
Specifications
Heat dissipator cover
Model: YK580
Applications
Description
The YK580 heat sink is a precision-stretched and shaped heat dissipation component made of high thermal conductivity metal substrate. It integrates multiple sets of mounting holes, a shaped heat dissipation chamber, and a buckle fixing structure, providing efficient heat dissipation. The product is compatible with shaped PCB component layouts and can be securely installed through soldering or buckling. It can quickly reduce the operating temperature of core components while isolating electromagnetic interference between circuits. It meets environmental and electronic industry standards and is widely used in component heat dissipation and electromagnetic protection in industrial control equipment, communication motherboards, automotive electronics, consumer electronics, and other scenarios.
Whitepapers
Related Cases
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